New Taipei City, Taiwan, March 9, 2026 – Vecow Co., Ltd., a global team of embedded experts, is proud to announce that its TGS-2000 Series Stackable AI PC has been honored with the embedded world Best in Show award by Embedded Computing Design (ECD). This prestigious recognition, evaluated by a distinguished editorial team, celebrates excellence in design, performance, and market impact within the global embedded industry.
“The TGS-2000 series is a testament to Vecow’s leading-edge R&D capabilities and superior execution efficiency,” said Eric Yu, President of Vecow. “I am immensely proud of our engineering team’s ability to master the next-generation Intel platform ahead of the competition. By delivering this advanced technology with unmatched time-to-market, we are empowering our global partners to seize early opportunities in Generative AI and Agentic Intelligence. This award validates our position as a frontrunner in the modular edge computing market.”
“These are the best-in-class embedded systems and products on the market right now,” added Ken Briodagh, Editor-in-Chief of Embedded Computing Design. “Our Best in Show Awards Submissions have grown every year and this is quite an accomplishment to be selected.”
Redefining Edge AI Performance and Flexibility
The Vecow TGS-2000 is the market’s first stackable AI PC powered by Intel® Core™ Ultra Series 3 processors (Panther Lake). Delivering an impressive 100 platform TOPS, it masters localized AI inference in a space-efficient, NUC-sized form factor. The series shatters the performance limitations of traditional systems by integrating an innovative tool-less modular design. This “building block” approach allows for seamless expansion of high-performance MXM GPU docking, enabling the system to scale from a streamlined edge controller to a high-density computing node.
Engineered for trusted reliability, the TGS-2000 supports wide-range power input (DC 12V to 24V) and operating temperatures (-25°C to 55°C). It is the premier solution for heavy-duty AI applications where space, ruggedness, and cutting-edge performance are at a premium.